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Sputtering System 】

RS16-13540A Sputtering System SH-100B MH61-0496 ULVAC 1987 Inquiry Form Batch Type Only the equipment was energized and the exhaust system was checked for operation. RS13-22040A Sputtering System SH-350-D06 MH62-5073 ULVAC 1988 Form Batch Type Vacuum Pump Diffusion Pump + Rotary Pump Sputter Source φ 150 mm cathode Direction Sputter-up

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- Magnetron sputter-

Specifications of Magnetron Sputtering System 1. Vacuum chamber module a. Process chamber Chamber size (ID250 x H300(mm)) Hinged Top door Rear of chamber pump and pumping line installation Ports for Pumping, venting, gauge, window, thermal boat, valves, etc. b. Substrate holder (plate) about OD 50 mm, plate for Φ 2 inch x

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Sputtering Equipment Thomasnet

Custom manufacturer of sputtering equipment including magnetron sputtering sources. Features of magnetron sputtering sources include cryogenic pumping package, co-deposition sputter source controls, down stream partial pressure gas controls, electronic vacuum flange hoists, fully automated PLC system controls, deposition debris & magnetic manipulator transfer arm.

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AdNaNoTek Magnitron Sputter Sputter system e beam

AdNaNoTek's Magnetron Sputtering Deposition (Sputter) can deposit small- to large-size thin-film with extremely high quality and a great repeatability. DC, RF, or pulsed DC power supplies can be used depending on the kind of material you want to deposit. In addition, single, con focal, or parallel configuration can be designed to allow more flexibility and variations in the thin layer film

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Sputtering Equipment Suppliers Photonics Buyers' Guide

sputtering A vacuum deposition method in which the coating material (target) is removed from the surface of the coating source (cathode) by ion bombardment and deposited upon the substrates.; cold sputtering The application of coating without heating of the substrates.; cathode sputtering The method of disintegrating the substance of the cathode by bombarding it with ions and depositing it on

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AJA MAGNETRON SPUTTER SYSTEM OPERATING MANUAL

equipment. 1.2 Description Homebuilt RF & DC Sputtering System (Homebuilt) can be used to sputter highly uniform metal, semiconductor or dielectric films. The Homebuilt sputter is a fully automated PLC controlled deposition system. All vacuum functionality and RF to DC switching is controlled by a

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Sputtering Equipment Suppliers Photonics Buyers' Guide

sputtering A vacuum deposition method in which the coating material (target) is removed from the surface of the coating source (cathode) by ion bombardment and deposited upon the substrates.; cold sputtering The application of coating without heating of the substrates.; cathode sputtering The method of disintegrating the substance of the cathode by bombarding it with ions and depositing it on

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Kurt J. Lesker Company LAB Line Home Vacuum Science

LAB Line Overview. The Kurt J. Lesker Company ® LAB Line UHV Sputter platform is purpose built for magnetron sputtering deposition applications. A chamber design tailored to fit UHV sputter process needs, an industry best software control system with advanced programming, load lock capability, and numerous features for optimized thin film performance are a few of the advantages offered in

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Specifications of Multi Target sputtering system

Specifications of Multi Target sputtering system 1.General 1.1. The equipment should be able to deposit any combination of metals, metal alloys, composites, semiconductors, insulators on semiconductor/ glass/ metal/ alloy substrates in a single run as per the number of sputter sources and power supplies detailed herein.

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Improving vacuum control for sputter coating Alicat

While research and development facilities may create their own sputtering systems, many commercial options also exist. The role of vacuum control in sputter coating systems. The performance of sputter coating systems depends on many factors, with process gas partial-pressures and overall system pressure being among the most important.

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Thin Film Deposition Systems Denton Vacuum

Enabling Innovation in Thin Film Deposition. With a focus on evaporation, sputtering, PE-CVD, ion beam deposition and more, Denton Vacuum supports the evolving needs of the semiconductor, opto-electronics and display, microscopy and microanalysis and medical markets.

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Ion Beam Sputtering & Ion Beam Deposition Systems

Ion Beam Sputtering (IBS), also called Ion Beam Deposition (IBD), is a thin film deposition process that uses an ion source to deposit or sputter a target material (metal or dielectric) onto a substrate to create either a metallic or dielectric film. Because the ion beam is monoenergetic (ions possess the equal energy) and highly collimated, it enables extremely precise thickness control and

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Sputtering Equipment Thomasnet

Custom manufacturer of sputtering equipment including magnetron sputtering sources. Features of magnetron sputtering sources include cryogenic pumping package, co-deposition sputter source controls, down stream partial pressure gas controls, electronic vacuum flange hoists, fully automated PLC system controls, deposition debris & magnetic manipulator transfer arm.

Get Price
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AJA MAGNETRON SPUTTER SYSTEM OPERATING MANUAL

equipment. 1.2 Description Homebuilt RF & DC Sputtering System (Homebuilt) can be used to sputter highly uniform metal, semiconductor or dielectric films. The Homebuilt sputter is a fully automated PLC controlled deposition system. All vacuum functionality and RF to DC switching is controlled by a

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DC Plasma Magnetron Sputter coating-CYKY

Magnetron sputtering is a high-rate vacuum coating technique that allows the deposition of many types of materials, including metals and ceramics, onto as many types of substrate materials by the use of a specially formed magnetic field applied to a diode sputtering target

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Sputter Products KDF Electronics

KDF systems can be customized to meet the customer's needs and cover a wide variety of process requirements for the mainstream silicon, emerging materials and flat panel display markets. The complete line of KDF equipment has been redesigned and improved to meet today's critical applications.

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Sputtering Systems Semicore Equipment, Inc

On an atomic level, sputtering is the process whereby atoms of a target or source material is bombarded by high energy particles in a vacuum environment that "knocks off" or "sputters" atoms that are deposited as a thin film onto a substrate such as a

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Sputter Deposition an overview ScienceDirect Topics

Donald M. Mattox, in The Foundations of Vacuum Coating Technology (Second Edition), 2018 Abstract. Sputtering and sputter deposition using inductive pulsed high voltage was the first vacuum coating process. For about 75 years (18521920s) high-voltage pulses from induction coils were the principal source of voltage for physical sputtering.

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Deposition Equipment Used, Surplus, Refurbished

VARIAN 3190 SPUTTER SYSTEM Load locked single wafer sputter, cassette to cassette vertically mounted for sideways sputter Currently configured for 100mm wafers 3 Target mini-quantums RF Etch VIPS (Vacuum Isolated Processing Station) Residual Gas Analyzer

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Sputter Coating— Its Principles and Potential

THE SPUTTERING PROCESS is a vacuum coating method wherein coating material is passed into the vapor phase by ion bombardment of a source consisting of the material in ques-tion. In the simplest sputtering configuration, the source of coating material (target) and the part to be coated (substrate) are placed in a chamber which is evacuated and

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Japan sputter target in vacuum-guide

products Sputtering Targets produced at both our US and Japanese facilities, Tosoh's sputtering targets are available in a variety of high purity metals, metal alloys, cermets, and ceramic compositions. Targets can be made in all shapes, sizes, and purity levels to meet design specifications.

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Sputter Archives SemiStar Corp.

CPA S-Gun Sputter Deposition / Sputter-Gun System (3 S-Guns)

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Kurt J. Lesker Company Thin Film Deposition Systems

"The sputtering system we purchased from Kurt J. Lesker Company produces uniform, smooth, reproducible high quality thin films, which greatly helps us achieve our research goals." We offer our customers the advantage of unparalleled knowledge and expertise in the manufacturing of thin film vacuum deposition systems by staying on the leading

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Multi-Technique Thin Film Deposition / Analysis Systems

The dual sputtering system above is connected by a common load-lock with (6) position cassette with "vacuum suitcase" compatibility. The chamber on the left includes (7) fixed angle sputter sources and has a 1.0 x 10-8 Torr base pressure.

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Sputtering Systems at Best Price in India

RF & DC Sputtering is a widely used and highly versatile vacuum coating system used for the deposition of a variety of coating materials. Sputtering deposition systems use high energy particles as a way of transferring kinetic energy to a target in order to remove material for deposition.

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Sputter and Carbon Coaters Q Plus Quorum Technologies Ltd

Suitable for multi-layer sequential sputtering of two materials, the Q300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used

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VACUUM COATING & SPUTTERING Ted Pella, Inc.

The disc or foil type sputter targets are avail-able in 60, 57, 54, 50, 38 and 19mm diameter. Most of the disk type targets are clamped to the target holder by a target clamping ring; simply unscrew the clamping ring and change the target. Annular targets, 82mm in diameter are available in gold or gold/palladium. For Product Details and

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Sputter Deposition System Glow Research

System for Thin Film, Sputter, PVD, Thin Film Deposition, Vacuum Coating, Metallic or Dielectric Thin Film Deposition. The Glow Research SputterGlow is a flexible sputter deposition system designed to process 200mm wafers, 156mm x 156mm solar cells or smaller wafersincluding pieces of wafers.

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sPuTTering sysTems SINGULUS

Multi-Target-Module, Oxidation-Process-Module, Pre-Clean-Module, Combi-Process-Module, Four- Target-Module and Static-Deposition-Module as well as the Rotating-Substrate-Module. The RSM is the core module of the ROTARIS platform, our sputtering system for special R&D applications. The TIMARIS PVD modules incorporate the full scope of sputtering

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What Is Sputtering? Magnetron Sputtering?

Nov 24, 2014 · The sputtering process begins when a substrate to be coated is placed in a vacuum chamber containing an inert gas usually Argon and a negative charge is applied to a target source material that will be deposited onto the substrate causing the plasma to glow.

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